Heat sink, BGA, Black anodized, 3 °C/W, BGA, 35 mm, 12 mm, 35 mm

Heat Sink, Extrusion Range - 1, 2.8 °C/W, 105 mm, 25.4 mm, 50 mm

Heat sink, TO-220, 20 °C/W, TO-220, 22 mm, 19 mm, 11 mm

Heat sink, square, PCB, extruded, LED, 1.75 °C/W, 100 mm, 25 mm, 100 mm

Heat sink, for transistors, TO-220, black anodized, 21 °C/W, TO-220, 20.5 mm, 19.5 mm, 19 mm

Heat sink, standard extrusion, black anodized, 0.7 °C/W, 200 mm, 40 mm, 100 mm

Heat Sink, PCB, Board Level, 9.9 °C/W, TO-218, TO-220, 28 mm, 22 mm, 38 mm

Heat Sink, Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm

Heat sink, standard extrusion, black anodized, 1.65 °C/W, 200 mm, 25 mm, 50 mm

Heat Sink, Ball Grid Array, Standard, 8.2 °C/W, BGA, 40 mm, 18 mm, 40 mm

Heat Sink, for North Bridge, 4.2 °C/W, BGA, 37.5 mm, 33 mm, 37.5 mm

Heat Sink, 8.6 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 50 mm, 12.5 mm

Heat sink, 21 °C/W, BGA, 23 mm, 10 mm, 23 mm

Heat Sink, TO-220, 11 °C/W, SOT-32, TO-3P, TO-220, 34.9 mm, 12.7 mm, 38.1 mm

Heat sink, 60 °C/W, TO-92, 15.29 mm, 18.29 mm

Heat sink, extruded, 0.3 °C/W, 300 mm, 40 mm, 200 mm

Heat Sink, Square, Circuit Board, For SMT Packages, 63 °C/W, SOIC-20, SOIC-24, SSOP-48, TSSOP-48, TSSOP-56, TSSOP-64, 6.3 mm

Heat Sink, BGA, Black Anodized, BGA, 35 mm, 25 mm, 35 mm

Heat Sink, Ball Grid Array, Standard, 14 °C/W, BGA, 20 mm, 19.1 mm, 20 mm

Heat Sink Clip, SW Series, 7.24mm x 37.08mm